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AI & Machine Learning
RoboScience
Series AUndisclosed
RoundSeries A
AmountUndisclosed
LeadHupo Capital
HQShanghai, China
DateNovember 2, 2026
THE DEAL, AT A GLANCE

RoboScience

From the announcement
Who is involvedBacked by Hupo Capital, Shanghai Semiconductor Industry Investment, Dacheng Capital, Changshi CapitalFrom the announcement

Summarized from the deal record's source announcement; not yet independently reviewed.

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What happenedRoboScience raised Series A, announced 2026-11-02From the announcement

Summarized from the deal record's source announcement; not yet independently reviewed.

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Click a part to explore its evidence. Unsupported imagery is withheld rather than guessed.Original record source ↗

RoboScience · Financing Record

Explore source-linked visual explanations for RoboScience. Unsupported claims are withheld while source review continues.

Record 15127 · Recorded date: 2026-11-02

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